MediaTek Launches Groundbreaking Dimensity 8400 Chipset
Recently, MediaTek announced the introduction of its groundbreaking Dimensity 8400 chipset, marking a significant advancement in upper-midrange Android smartphone technology with a full big core CPU architecture. Following this announcement, Redmi quickly revealed plans to introduce the Redmi Turbo 4 as the first smartphone to utilize this innovative SoC in early January.
Realme Joins the Race with Dimensity 8400
The excitement doesn’t stop there. Realme is also gearing up to release a device featuring the Dimensity 8400, according to widely recognized Chinese tech insider Digital Chat Station on Weibo. This new addition will be known as the Realme Neo7 SE.
What’s Next for Realme’s Lineup?
The upcoming Neo7 SE will complement the already existing Neo7 model within Realme’s product lineup. Interestingly, this year marks a shift as Realme has decided not to include the GT branding in their series. While specifics regarding other features of the impending Realme Neo7 SE are still under wraps, it is anticipated that it will take position just below its sibling, suggesting a set of slightly less advanced specifications. Stay tuned for more updates as they become available.
Source A (in Chinese) | Source B (in Chinese)
