Credit: Carnegie Mellon University, College of Engineering
The Rising Energy Demands of Artificial Intelligence
The surge in artificial intelligence (AI) technology has led to a remarkable increase in energy usage. The U.S. Department of Energy estimates that the electricity consumption of AI data centers may see a threefold increase by 2028. Currently, around 40% of the total energy consumed by these data centers is dedicated to cooling powerful chips—an amount strikingly comparable to the entire electricity needs of California.
Revolutionizing Thermal Management with New Technology
In light of these challenges, Sheng Shen from Carnegie Mellon University’s Mechanical Engineering department has created an advanced thermal interface material (TIM) that surpasses current top-tier products on the market. This novel design, recently featured in Nature Communications, minimizes thermal resistance and enhances cooling performance through superior heat dissipation capabilities. Moreover, its reliability has been rigorously validated.
“This material functions as a connector bridging nano and macro dimensions,” stated Zexiao Wang, a Ph.D. candidate working under Shen’s direction. “The nanoscale properties can be realized using macroscopic production methods; thus we can visibly appreciate its global impact.”
Not only does Shen’s TIM excel relative to existing options; it also boasts impressive durability. Extensive testing subjected it to temperatures ranging from -55°C to 125°C over more than one thousand cycles without any decline in performance quality.
Extensive Applications Beyond Data Centers
“This advancement addresses numerous prevailing obstacles and is ready for immediate implementation,” remarked Shen. “While current priorities focus on managing data center cooling needs, this innovation extends widely across sectors still reliant on outdated thermal materials—it serves various purposes such as pre-packaging applications and facilitates non-adhesive processing or bonding at ambient temperatures.”
“Often research at the nanoscale lays foundational groundwork for devices that might not be seen until years later,” said Qixian Wang, another Ph.D. researcher in Shen’s lab. “It’s invigorating to witness how our technology can effect change practically today due to its user-friendly nature.”
“Our discovery promises significant advancements for AI computing technologies,” shared Dr. Rui Cheng, postdoctoral researcher and innovation fellow with CMU who led this project publication. “Not only does it contribute toward decreasing power expenditures but it simultaneously paves pathways for more cost-effective and environmentally sustainable AI development.”
Further Reading:
For additional insights:
Rui Cheng et al., “Liquid-infused nanostructured composite as a high-performance thermal interface material for effective cooling,” Nature Communications (2025). DOI: 10.1038/s41467-025-56163-8
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Carnegie Mellon University Mechanical Engineering
Citation:
This article reframes information regarding groundbreaking innovations designed to cut costs related to both cooling systems at AI data centers along with GPU/CPU energy consumption (2025). Last accessed February 4th via TechXplore News.
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