Apple’s Expanding Manufacturing Base in the U.S.
Apple has significantly increased its manufacturing presence on American soil, as the S9 chip designed for the Apple Watch is now reportedly being produced at TSMC’s facility located in Arizona.
The S9 Chip Production Begins
According to Tim Culpan, a tech journalist, TSMC has officially kicked off the production of Apple’s S9 System-in-Package (SiP) chip at its Fab 21 location near Phoenix. This facility also began manufacturing the A16 Bionic chip used in last year’s iPhone 15 and iPhone 15 Plus.
Key Features and Technology of the S9 Chip
The introduction of the S9 chip coincided with the launch of Apple Watch Series 9 in late 2023. This new chip builds upon processing capabilities taken from the A16 Bionic architecture. Both chips utilize TSMC’s state-of-the-art N4 process technology—based on a cutting-edge four-nanometer fabrication technique. This technological synergy has enabled TSMC to efficiently adapt its facilities to produce both chips concurrently. While Series 9 production is complete, it is worth highlighting that this chip also features prominently in the recently launched Apple Watch Ultra 2.
Growth at Fab 21
The integration of production for both A16 Bionic and S9 SiP marks a notable increase in output capacity since work started at Fab 21 back in September of last year with A16 production. The current setup allows for enhanced productivity through an accelerated ramp-up process particularly evident with additional SiP lines starting operations recently.
Pioneering Semiconductor Production Outside Taiwan
Touched by pioneering advancements, this Arizona plant stands as TSMC’s first significant semiconductor manufacturing operation established outside Taiwan; however, ongoing capacity building reflects that early stages are still underway here.
Current Capacity and Future Projections
The plant is currently operating under Phase 1A with monthly output levels hovering around approximately 10,000 wafers. Notably shared between different clients including AMD along with Apple’s own products like A16 and S9 chips; each wafer can result in hundreds of individual chips contingent upon die dimensions and efficiency metrics during production processes. Excitingly enough, upcoming Phase IB initiatives are projected to double operational capability up to 24,000 wafers per month by mid-year.’
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