Anticipated Release of the Oppo Find X8 Series in April
Oppo is set to unveil a new lineup of Find X8 smartphones in April. Zhou Yibao, the Product Manager for premium devices at Oppo, has revealed that the upcoming Find X8S will feature an exceptionally slim bezel on all sides, surpassing even the narrow edges found on the Apple iPhone 16 Pro Max.
Innovative Design Techniques
The bezel thickness is expected to be “1.xx mm,” thanks to a groundbreaking Chip-on-Panel (COP) packaging technology pioneered by Oppo. This innovative approach allows for the display driver chip to be embedded directly into the screen, eliminating the need for a separate and bulkier driver integrated circuit (IC).
This advancement not only facilitates sleeker designs but also enhances energy efficiency. However, it does come with its share of challenges; manufacturing these advanced panels is complex and generally incurs higher costs compared to conventional display technologies.
A Glimpse into Upcoming Variants
As part of this upcoming launch event, fans can look forward to discovering not only the Find X8S—a more compact version—but also an enhanced model designated as Find X8S+. Additionally, tech enthusiasts are particularly eager about the unveiling of the impressive Find X8 Ultra, which is rumored to boast five cameras.
Source (in Chinese) | Via